OS GSO IEC 62047-9:2014
IEC 62047-9:2011
Omani Standard
Current Edition
·
Approved on
25 December 2014
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
OS GSO IEC 62047-9:2014 Files
English
49 Pages
Current Edition
Reference Language
Obtaining this standard through the store is currently unavailable. You can acquire it directly from its source.
OS GSO IEC 62047-9:2014 Scope
This standard describes bonding strength measurement method of wafer to wafer bonding,
type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic
bonding, etc., and applicable structure size during MEMS processing/assembly. The
applicable wafer thickness is in the range of 10 µm to several millimeters.
Best Sellers From Electrical Sector
GSO 2530:2016
Gulf Standard
Energy Labelling And Minimum Energy Performance Requirements For Air-Conditioners
OS GSO 2530:2016
GSO 2530:2016
Omani Standard
Energy Labelling And Minimum Energy Performance Requirements For Air-Conditioners
OS GSO 34:2007
GSO 34:2007
Omani Standard
LEAD-ACID STARTER BATTERIES USED FOR
MOTOR VEHICLES AND INTERNAL
COMBUSTION ENGINES
GSO 34:2007
Gulf Technical Regulation
LEAD-ACID STARTER BATTERIES USED FOR
MOTOR VEHICLES AND INTERNAL
COMBUSTION ENGINES
Recently Published from Electrical Sector
GSO IEC 61362:2026
IEC 61362:2024
Gulf Standard
Guidelines to specification of hydraulic turbine governing systems
GSO IEC TS 62271-313:2026
IEC TS 62271-313:2025
Gulf Standard
High-voltage switchgear and controlgear - Part 313: Direct current circuit-breakers
GSO ISO 20816-21:2026
ISO 20816-21:2025
Gulf Standard
Mechanical vibration — Measurement and evaluation of machine vibration — Part 21: Horizontal axis wind turbines
GSO CEN/TR 16999:2026
CEN/TR 16999:2019
Gulf Standard
Solar energy systems for roofs - Requirements for structural connections to solar panels
